Effect of ionic contamination on climatic reliability of printed circuit board assemblies
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Effect of Flux Systems on Electrochemical Migration of Lead-free Assembly
The reliability concerns regarding surface insulation resistance (SIR) and electrochemical migration (ECM) have been significantly raised in the printed circuit board (PCB) assembly with wide adoption of lead-free assembly materials and process. Moreover, the miniaturization trend of the electronic industry also increases the sensitivity of the functional assemblies to surface contamination and...
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