The Impact of Low Cost High Density Substrates on RF Structure Integration
نویسندگان
چکیده
A new low cost thin film substrate technology was developed within the EU research project LAP. The project’s substrate cost target of 1 US$/inch shall be obtained by using low cost materials and large area panel processing (LAP). This paper presents tests and measurements showing the process accuracy and the geometric variations resulting from low cost manufacturing. The second part is focusing on the impact on RF structure integration and on partitioning aspects for RF chip-package co-design.
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