Analytical analysis of the generic SET and RESET characteristics of electrochemical metallization memory cells.
نویسندگان
چکیده
We report on an analytical model which describes the bipolar resistive switching in electrochemical metallization cells. To simulate the resistive switching, we modeled the growth and dissolution of a metallic filament together with electron tunneling between the growing filament and the counter electrode. The model accounts for the controllability of the low resistive state and the RESET current by tuning the SET current. By analytical analysis the relevant conditions for these generic characteristics are identified. In addition, an explanation for the asymmetry in the SET and RESET switching characteristics is presented. The results of the analytical analysis is generalized to all types of ReRAMs.
منابع مشابه
Advanced Cu chemical displacement technique for SiO2-based electrochemical metallization ReRAM application
This study investigates an advanced copper (Cu) chemical displacement technique (CDT) with varying the chemical displacement time for fabricating Cu/SiO2-stacked resistive random-access memory (ReRAM). Compared with other Cu deposition methods, this CDT easily controls the interface of the Cu-insulator, the switching layer thickness, and the immunity of the Cu etching process, assisting the 1-t...
متن کاملAnalysis of the Negative-SET Behaviors in Cu/ZrO2/Pt Devices
Metal oxide-based electrochemical metallization memory (ECM) shows promising performance for next generation non-volatile memory. The negative-SET behavior has been observed in various oxide-based ECM devices. But the underlying mechanism of this behavior remains unaddressed and the role of the metal cation and oxygen vacancy in this behavior is unclear. In this work, we have observed two kinds...
متن کاملSwitching kinetics of electrochemical metallization memory cells.
The strongly nonlinear switching kinetics of electrochemical metallization memory (ECM) cells are investigated using an advanced 1D simulation model. It is based on the electrochemical growth and dissolution of a Ag or Cu filament within a solid thin film and accounts for nucleation effects, charge transfer, and cation drift. The model predictions are consistent with experimental switching resu...
متن کاملImpact of Electrode Surface Morphology in ZnO-Based Resistive Random Access Memory Fabricated Using the Cu Chemical Displacement Technique
Electrochemical-metallization-type resistive random access memories (ReRAMs) show promising performance as next-generation nonvolatile memory. In this paper, the Cu chemical displacement technique (CDT) is used to form the bottom electrode of ReRAM devices. Compared with conventional deposition methods, the Cu-CDT method has numerous advantages for ReRAM fabrication, including low cost, low tem...
متن کاملNanoscale cation motion in TaO(x), HfO(x) and TiO(x) memristive systems.
A detailed understanding of the resistive switching mechanisms that operate in redox-based resistive random-access memories (ReRAM) is key to controlling these memristive devices and formulating appropriate design rules. Based on distinct fundamental switching mechanisms, two types of ReRAM have emerged: electrochemical metallization memories, in which the mobile species is thought to be metal ...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید
ثبت ناماگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید
ورودعنوان ژورنال:
- Nanoscale
دوره 5 22 شماره
صفحات -
تاریخ انتشار 2013