Laser Assisted Chemical Mechanical Polishing for Planarization
نویسندگان
چکیده
منابع مشابه
Customer Application Brief Electronics Chemical Mechanical Planarization (CMP) Slurry Manufacturing
Introduction The Chemical Mechanical Planarization (CMP) process plays a key role in the manufacture of data storage, video display panels, and semiconductor chips. The process combines the chemical (acidic or basic) effect of the slurry, which contains micro-abrasives with the mechanical effect provided by polishing to reduce the topography on the wafer or rigid disk substrate. The process for...
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We have used a large pattern test mask and a specific arrangement of structures on a wafer for direct measurement of an average planarization length for copper chemical mechanical polishing (CMP) processes. We propose new minimum, maximum, and average planarization length definitions, based on up and down area measurements as a function of trench width. The average planarization length is usefu...
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