Embedded Power-An Integration Packaging Technology for IPEMs
نویسندگان
چکیده
A hybrid MCM-based 3-D integration technology for packaging intelligent power electronics modules has been developed. The bare power chips are buried in the ceramic frame with dispensed and screen printed dielectric encapsulates. This dielectric coating is designed to achieve planarization and open up the contacts of the power chips. A metallization layer, deposited and patterned on top of the dielectric layer, provides the interconnection for power devices and drive/protection circuitry. The properties of materials involved have been evaluated and every single processing technology has been optimized. Prototype IPEMs have demonstrated the advantage features and the feasibility of this power electronics integration approach. The design, processing technology, and experimental results are presented in this work.
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