Modeling and Analysis of Multichip Module Power Supply Planes
نویسندگان
چکیده
A modified SPICE is used to accommodate distributed circuits. The distributed circuits are built with microwave analysis software and connected to SPICE by s-parameter files. The modeling process is described and examples of thick and thin film power supply planes are presented with comparison to measured results. The method is used to explore potential design choices for a large MCM with many simultaneously switching drivers. Modeling and Analysis of Multichip Module Power Supply Planes
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