Simple Temperature Measurements to Calibrate a Computational Fluid Dynamics Model of a CPGA/Heatsink Assemblies to Optimize Heatsink Performance by
نویسندگان
چکیده
Due to the emphasis on silicon junction temperatures in product testing, accura te velocities are typically not measured. Thus it is difficult to determine the flow boundary conditions for a numerical the rmal / f lu id analysis. Thermal conductivity values provided by vendors can also be in error. A calibration procedure using only simple temperature measu remen t s was developed to correlate a numer i ca l model to the physical system. The calibrated model was then used to predict the performance of several proposed heats ink designs. The predicted performance correlated well with experimental results.
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