Development of Microwave Package Models Utilizing On-Wafer Characterization Techniques
نویسندگان
چکیده
A package characterization technique using coplanar waveguide (CPW) probes and line–reflect–match (LRM) calibrations for surface-mountable packages is presented. CPWto-package adapters (CPA) are fabricated on alumina substrates to mount and measure the high-frequency response of plastic packages. Offset CPA standards in conjunction with an LRM calibration are used to de-embed the response of the adapters from the measured S-parameters. Application of this method is demonstrated by characterizing and modeling surface-mount microwave plastic packages.
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