Oxygen Plasma-free Microfluidic Device Sealing

In the current work we describe the development of an oxygen plasma-free microfluidic device sealing method with tunable properties. In particular, it allows the end-user to bond PDMS-glass microfluidic devices using nothing more than some mild acidic buffer, and access to an oven, and achieve burst pressures of more than 80 psi, or 0.55 MPa. The minimal requirements on the processing steps make microfluidic diagnostics involving non-injectable components such as solid tissues samples in resource-poor countries both technically and economically viable.