Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling
نویسندگان
چکیده
The ever increasing power density in modern semiconductor devices requires heat dissipation solution such as heat sink to remove heat away from the device. A compressive loading is usually applied to reduce the interfacial thermal resistance between package and heat sink. In this paper, both experimental approaches and numerical modeling were employed to study the effect of compressive loading on the interconnect reliability under thermal cycling conditions. A special loading fixture which simulated the heat sink was designed to apply compressive loading to the package. The JEDEC standard thermal cycle tests were performed and the resistance of daisy chained circuits was in situ measured. The time to crack initiation and time to permanent failure were identified separately based on in situ resistance measurement results. Failure analysis has been performed to identify the failure modes of solder joint with and without the presence of compressive loading. A finite element based thermal-fatigue life prediction model for SAC305 solder joint under compressive loading was also developed to understand the thermal-fatigue crack behaviors of solder joint and successfully validated with the experimental results. [DOI: 10.1115/1.4007674]
منابع مشابه
Improved reliability of copper-cored solder joints under a harsh thermal cycling condition
This study simulated the performance of Cu-cored solder joints in microelectronic components subjected to the extreme thermal cycling conditions often encountered in the automobile industry by comparing the thermal cycling behavior of Cu-cored solder joints containing two different coating layers of Sn– 3.0Ag and Sn–1.0In with that of a baseline Sn–3.0Ag–0.5Cu solder joint under a severe temper...
متن کاملEffect of substrate flexibility on solder joint reliability. Part II: finite element modeling
Solder joint fatigue failure is a serious reliability concern in area array technologies, such as flip chip and ball grid array packages of integrated-circuit chips. The selection of different substrate materials could affect solder joint thermal fatigue life significantly. The mechanism of substrate flexibility on improving solder joint thermal fatigue was investigated by thermal mechanical an...
متن کاملThe Limited Reliability of Board-Level SAC Solder Joints under both Mechanical and Thermo-mechanical Loads
The trend of miniaturization, light weight, high speed and multifunction are common in electronic assemblies, especially, for portable electronic products. In particular, board-level solder joint reliability, in term of both mechanical (e.g., drop impact) and thermo-mechanical (e.g., thermal cycling) loads is of great concern for portable electronic products. The transition to lead-free solder ...
متن کاملA review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products
Currently, the portable electronic products trend to high speed, light weight, miniaturization and multifunctionality. In that field, solder joint reliability in term of both drop impact and thermal cycling loading conditions is a great concern for portable electronic products. The transition to lead-free solder happened to coincide with a dramatic increase in portable electronic products. Sn–A...
متن کاملBest Practice Guide for Thermocycling and Reliability Assessment of Solder Joints
This guide recommends best practice used for short-term accelerated thermal cycling as a method for assessing solder joint reliability. Three techniques (shear testing, and electrical continuity measurements, complemented with microstructural investigations) are described. NPL Report CMMT(A)274 © Crown copyright 2000 Reproduced by permission of the Controller of HMSO
متن کامل