Automating Routine Analysis in Electronic Packaging Using Product Model-based Analytical Models (pbams), Part Ii: Solder Joint Fatigue Case Studies

Nomenclature A new representation of engineering analysis models, termed product model-based analytical models (PBAMs) was introduced previously [Peak and Fulton, 1992b]. Since PBAMs link analysis information with detailed design information, they enable rapid, flexible analysis in support of product design. Nf average cycles to failure ∆ε p plastic cyclic strain range c fatigue ductility exponent εf ' fatigue ductility coefficient T mean cyclic temperature, (oC) This document, Part II of two companion papers, describes PBAMs of representative solder joint fatigue models that illustrate and evaluate the PBAM representation. Part I overviews the PBAM representation and defines the constraint schematic notation used in this paper. f load frequency, (cycles/day, 1 ≤ f ≤ 1000) Tsj mean cyclic solder joint temperature (°C) ∆γ sj solder joint shear strain range F adjustment factor Results show that PBAMs provide rapid analysis results from mixed formula-based and finite element-based analysis models. In some cases different input/output combinations can be run; hence, both design analysis and limited design synthesis can be supported by the same PBAM. ∆ ∆ ( ) α T steady state thermal expansion mismatch To reference temperature Tss steady state temperature L length