The effect of atmospheric moisture on crack propagation in the interface between directly bonded silicon wafers

نویسندگان

  • V. Masteika
  • J. Kowal
  • N. St. J. Braithwaite
  • T. Rogers
چکیده

Infra-red video sequences were taken of directly bonded silicon wafer pairs undergoing the razor blade crack length test for bond strength in a specially designed jig. A series of tests were carried out under controlled atmospheres of nitrogen at various relative humidities. Analysis of the video images showed that the crack continues to propagate rapidly for several minutes after the blade has stopped moving, and that the presence of moisture has a strong positive influence on the rate of crack propagation under static loading. A new Maszara protcol is suggested based on modelling crack growth using our experimentally derived constants.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

The effect of atmospheric moisture on crack propagation of the interface between directly bonded silicon wafers

Infra-red video sequences were taken of directly bonded silicon wafer pairs undergoing the razor blade crack length test for bond strength in a specially designed jig. A series of tests were carried out under controlled atmospheres of nitrogen at various relative humidities. Analysis of the video images showed that the crack continues to propagate rapidly for several minutes after the blade has...

متن کامل

Modelling Temperature Dependency of Silicon Nitride Formation Kinetic during Reaction Bonded Method

An accurate prediction of reaction kinetics of silicon nitridation is of great importance in designing procedure of material production and controlling of reaction. The main purpose of the present study is to investigate the effect of temperature on the kinetics of reaction bonded silicon nitride (RBSN) formation. To achieve this, nitrogen diffusion in the silicon nitride layer is considered as...

متن کامل

Risk assessment of the crack propagation and delamination of the Cu-to-Cu direct bonded (CuDB) interface

Article history: Received 31 December 2015 Received in revised form 13 September 2016 Accepted 24 September 2016 Available online xxxx Through Silicon Via (TSV) technologywithmicro joint has been identified as the 3D package technology to overcome the limitations of I/O density and enhances the system performance compared to that of the conventional flip chip packages. One of the challenges of ...

متن کامل

Effect of Moisture Content on Shear Strength of Offshore Clay Interface Steel Surface

This paper investigates the effect of moisture content on interface shear strength between offshore clay and steel plate. Although, sensitive and high plasticity offshore clay deposits are widely distributed in Malaysia and many other countries in the world, and steel is a vital construction material for many structures, research works on interaction between offshore clay and steel surface are ...

متن کامل

Low loss coupler to interface silicon waveguide and hybrid plasmonic waveguide

A metallic coupler is proposed to interface a silicon on insulator (SOI) waveguide with a narrow hybrid plasmonic waveguide (200× 200 nm). The device operation is investigated and optimized to attain the best tradeoff between the mode confinement and the propagation loss. Calculations reveal that a high confinement and low loss of the energy is achieved from a silicon slab waveguide into the di...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 2016