Advanced Module Packaging Method
نویسنده
چکیده
Abstract An intermediate solution between conventional printed circuit board technology and wafer level packaging, WLP, is to fabricate interconnection circuits and flip chip assembly structures on large glass substrates using LCD manufacturing equipment. Trace widths of 5 microns and a trace pitch of 10 microns are achievable on flexible substrates as large as 1800 x 1500 mm. Back planes for displays and keyboards can also utilize thin film transistors, TFTs, as developed for LCDs and enhanced for flexible assemblies (200oC processing). A flexible circuit is built on a glass carrier with an intermediate release layer. The carrier is discarded after all processing is complete, including interconnection circuits, IC chip assembly, test and rework. The assembly method uses gold stud bumps on IC chips, and corresponding wells filled with solder on the motherboard. 100-micron pad pitch is achievable for IC chips, module cables, and test connections. Avoidance of epoxy under layers contributes to a robust capability for reworking defective IC chips. The methods are applicable to a wide range of products, from cell phones to blade servers.
منابع مشابه
Advanced System Packaging for Embedded High Performance Computing
Recent advances in microelectronic packaging promise unprecedented levels of performance for embedded computing. High performance machines that have been traditionally confined to a computer room environment can now be packaged for airborne, shipborne, or mobile applications. Multichip module (MCM) packaging has emerged as the first step in achieving this level of integration. However, new tech...
متن کاملA Novel Test Technique for MCM Substrates - Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions
This paper describes a novel and low-cost test technique that is capable of detecting process related defects such as opens and shorts in multichip module (MCM) substrates. This method is an alternative to existing test methods such as electron beam, capacitance, resistance, and electrical module test (EMT) techniques which are either expensive in terms of test equipment, are cumbersome due to ...
متن کاملAdvanced Packaging Technologies used in NASA ’ s 3 D Space Flight Computer
During 1995-1997, NASA’s New Millennium Program developed the 3 0 Flight Computer technology for validation on its j r s t Deep-Space I mission launched in October 1998. Whereas, the computer was not delivered on schedule for inclusion on the spacecraft, it was delivered, integrated and space qualified at JPL. This computer is characterized by the aggressive use of advanced packaging technologi...
متن کاملStudy on the Thermal Resistance of Multi-chip Module High Power LED Packaging Heat Dissipation System
Thermal resistance is a key technical index which indicates the thermal management of multi-chip module high power LED (MCM-LED) packaging heat dissipation system. In this paper, the prototype structure of MCM-LED packaging heat dissipation system is proposed to study the reliable thermal resistance calculation method. In order to analyze the total thermal resistance of the MCM-LED packaging he...
متن کاملMCM technology and design for the S/390 G5 system
The multichip module (MCM) that contains the central electronic complex (CEC) of the S/390 G5 system is described in this paper. The glass-ceramic module, topped with six layers of polyimide full-field thin-film wiring for chipto-chip interconnection, represents IBM’s most advanced packaging technology. This MCM provides a large wiring capacity, with 595 meters of routed interconnection; it sup...
متن کامل