Measurement of Thermally Induced Warpage of BGA Packages/Substrates Using Phase-Stepping Shadow Moiré
نویسندگان
چکیده
Phase-stepping technique is applied to the analysis of fringe pattern images of BGAs (Ball Grid Arrays) obtained by shadow moiré. Sensitivity of the fringe pattern analysis is demonstrated to be significantly increased. Thermally induced warpage of BGAs is successfully measured in real-time as the sample is driven through a simulated reflow process. The paper discusses the technique of phase stepping and its application to the shadow moiré method. Applications of the technology are presented.
منابع مشابه
On-Line Measurement of Thermally Induced Warpage of BGAs with High Sensitivity Shadow Moiré On-Line Measurement of Thermally Induced Warpage of BGAs with High Sensitivity Shadow Moiré
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