SOI-CMOS-MEMS Electrothermal Micromirror Arrays
نویسنده
چکیده
منابع مشابه
Design and characterization of a 3D MEMS VOA driven by hybrid electromagnetic and electrothermal actuation mechanisms
By using a CMOS compatible process technology, a MEMS variable optical attenuator (VOA) is characterized in terms of actuation mechanisms. A dual-fiber collimator is aligned perpendicularly to the micromirror in a three-dimensional (3D) free space configuration, where the micromirror is mechanically connected with an electromagnetic actuator and two sets of electrothermal actuators. Three types...
متن کاملManufacture of Micromirror Arrays Using a CMOS-MEMS Technique
In this study we used the commercial 0.35 μm CMOS (complementary metal oxide semiconductor) process and simple maskless post-processing to fabricate an array of micromirrors exhibiting high natural frequency. The micromirrors were manufactured from aluminum; the sacrificial layer was silicon dioxide. Because we fabricated the micromirror arrays using the standard CMOS process, they have the pot...
متن کاملStudy of hybrid driven micromirrors for 3-D variable optical attenuator applications.
Aluminium-coated micromirrors driven by electrothermal and electromagnetic actuations have been demonstrated for 3-D variable optical attenuation applications. Three types of attenuation schemes based on electrothermal, electromagnetic and hybrid, i.e. combination of electrothermal and electromagnetic, actuations have been developed. In addition, two different designs have been fabricated and c...
متن کاملAn Analytical Electrothermal Model of a 1-D Electrothermal MEMS Micromirror
We have developed an analytical model that describes the steady-state thermal behavior of a 1-D electrothermal bimorph MEMS micromirror. The steady-state 1-D heat transport equation is used to solve for the temperature distribution of the device upon actuation. Three models are developed using different thermal conditions on the device. The models consider heat dissipation from conduction and c...
متن کاملFlip-chip Integrated Soi-cmos-mems Fabrication Technology
A fully-dry, flip-chip fabrication technology was developed for the integration of high fill factor, silicon-on-insulator (SOI) structures and CMOS-MEMS actuators. An SOI mirror array with a fill factor of 95% and radius of curvature >1.3 m was fabricated on CMOS-MEMS electrothermal actuators using this technology. The unloaded actuators achieved an optical scan range of >92o. Following flip-ch...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
عنوان ژورنال:
دوره شماره
صفحات -
تاریخ انتشار 2010