System-level Packaging: Putting It All Together
نویسندگان
چکیده
E lectronic packaging at APL is radically different today than it was in the past. Limited funding, shorter schedules, packaging densities, and higher power requirements place an entirely new set of criteria on the packaging designs. New processes and fabrication techniques are evolving faster than the established reliability framework can support. Electronic packaging design involves many separate elements and disciplines. Streamlining the design process requires that these separate disciplines be integrated into a common effort via concurrent engineering. (
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