Wafer-Level Packaging For RF Passive Integration
نویسندگان
چکیده
Wafer-level packaging (WLP) technology offers novel opportunities for the realisation of highquality on-chip passives needed in RF front-ends. IMEC proposes thin-film WLP technology in combination with 90nm CMOS as a cost-effective approach to integrate RF and microwave systems. The potential of this technology is assessed by means of two demonstrator sub-circuits: a low-power voltage-controlled oscillator (VCO, 5GHz and 15GHz) and a 24GHz low-noise amplifier (LNA) with record noise figure.
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