Stap - a Finite Element Simulator for Three-dimensional Thermal Analysis of Interconnect Structures
نویسندگان
چکیده
We have developed a twoand three-dimensional simulation tool for a coupled electro-thermal analysis of VLSI interconnect lines, which uses the finite element method to solve Laplace's equation and the heat conduction equation. Thereby, triangular and tetrahedral grid elements with linear and quadratic shape functions are used. Two preprocessors allow a layer-based input of the simulation geometry and specification of boundary conditions for voltage, current and temperature. They are also responsible for the generation of the simulation grid. The main program calculates the potential and temperature distributions and extracts the resistance between two contacts. Two application examples are presented.
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