Wafer-level hermetically sealed silicon photonic MEMS

The emerging fields of silicon (Si) photonic micro–electromechanical systems (MEMS) and optomechanics enable a wide range novel high-performance devices with ultra-low power consumption, such as integrated optical MEMS phase shifters, tunable couplers, switches, optomechanical resonators. In contrast to conventional SiO 2 -clad Si photonics, have suspended movable parts that need be protected from environmental influence contamination during operation. Wafer-level hermetic sealing can cost-efficient solution, but are hermetically sealed inside cavities electrical feedthroughs not been demonstrated date, our knowledge. Here, we demonstrate wafer-level vacuum ultra-thin caps featuring connect the on grating couplers bond pads outside. We used built foundry wafers iSiPP50G photonics platform IMEC, Belgium. Vacuum confinement was confirmed by an observed increase cutoff frequency electro-mechanical response encapsulated due reduction air damping. extremely thin, small footprint, compatible subsequent flip-chip bonding onto interposers or printed circuit boards. Thus, approach for clears significant hurdle their application in circuits.