Uniformity of Electroless Copper Deposition.

Electroless Deposition and Electroplating of Metals

Formation of copper nanowires by electroless deposition using microtubules as templates.

Microtubules (MTs) are self-assembling, protein-based, tubular structures several micrometers long with outer and inner diameters of 25 nm and 15 nm, respectively. This aspect ratio makes MTs ideal templates for producing nanowires for applications such as electrical nano-interconnects. MTs are poorly conductive and their use as interconnects necessitates their metallization. We report a proces...

Seedless micropatterning of copper by electroless deposition on self-assembled monolayers

A novel approach for direct electroless (EL) patterning of copper films without catalysts has been developed. In a special electroless solution employed in the present study, the formation of copper particles was observed and the negatively charged surfaces were confirmed by zeta potential measurements. The conditions of the solution (ionic strength, pH, temperature, additives etc.) greatly aff...

A Pd-free activation method for electroless nickel deposition on copper

Article history: Received 4 June 2012 Accepted in revised form 30 March 2013 Available online 6 April 2013

Inkjet Catalyst Printing and Electroless Copper Deposition for Low-Cost Patterned Microwave Passive Devices on Paper

A scalable, low-cost process for fabricating copper-based microwave components on flexible, paper-based substrates is demonstrated. An inkjet printer is used to deposit a catalyst-bearing solution (tailored for such printing) in a desired pattern on commercially-available, recyclable, non-toxic (Teslin®) paper. The catalystbearing paper is then immersed in an aqueous copper-bearing solution to ...