Ultrasonic-assisted soldering of Cu/Ti joints

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Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention

A universally applicable method for promoting the fast formation and growth of high-density Sn whiskers on solders was developed by fabricating Mg/Sn-based solder/Mg joints using ultrasonic-assisted soldering at 250 °C for 6 s and then subjected to thermal aging at 25 °C for 7 d. The results showed that the use of the ultrasonic-assisted soldering could produce the supersaturated dissolution of...

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ژورنال

عنوان ژورنال: IOP Conference Series: Materials Science and Engineering

سال: 2018

ISSN: 1757-8981,1757-899X

DOI: 10.1088/1757-899x/322/2/022020