Tuning the electrical resistivity of conductive silver paste prepared by blending multi-morphologies and micro-nanometers silver powder

As an important interconnection material in electronics, conductive silver paste has attracted much research interest chip packaging and printed circuit board due to its predominant properties like high conductivity flexible interconnection. In this paper, the nanoparticles, sphere particles, flake powders are fabricated by various methods. Different proportions of powder selected prepare micro-silver micro-nano (mn) (fabricated nanoparticles:sphere particles:flake = 1:1:1). Compared traditional with content (containing 80 wt% silver), work contains only 66.67 silver. When ratio particle is 1:1, electrical resistivity cured at 200 °C for 45 min air about (3.31 ± 0.73) × 10?5 ? cm, resistance rises a little bit after being folded ten times. The addition nano-silver particles can reduce lower temperature curing. folding endurance mn comparable that sphere:flake 1:1.