Trend of BGACSPKGD. Flip-Chip Chip Size/Scale Package.

Design for Flip-Chip and Chip-Size Package Technology

As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologies. This movement is occurring at all levels: at the IC, at the IC package, at the module, at the hybrid, the PC board which ties all the systems together. Interconnection density and methodology becomes ...

Improving Heat Transfer from a Flip-Chip Package

The lid of an ASIC package can significantly increase the temperature of the die by impeding heat transfer. In flip-chip packages the backside of a die can be exposed by eliminating the lid, thus allowing a heat sink to be attached directly. Numerical finite difference methods and experimentation were used to investigate the differences between lidded and lidless flip-chip designs. The results ...

Flip Chip Challenges

Introduction Flip Chip packaging has seen an explosive growth in recent years. Over one billion devices a year are now assembled using flip chip technology. The majority are low lead count devices such as liquid crystal display drivers, watch modules, smart cards, and RFID tags. Recently the trend for higher I/O devices is to turn to flip chip in package (FCIP) as a packaging solution, which is...

Flip Chip on Organic Substrates

The attachment of a flip chip of moderate size and pitch to an organic substrate has lost much of its mystique in recent years. A small but increasing number of companies, including several contract manufacturers, is establishing flip chip capabilities. This can, in fact, be done in a step by step fashion and with moderate investments in facilities, equipment and training. Still, since only the...

All-copper Chip-to-substrate Interconnections for Flip-chip Packages