منابع مشابه
Tin Whiskers: Attributes And Mitigation
The movement to eliminate lead (Pb), especially active in Japan and the European Union, has resulted in an increasing use of pure tin (Sn) coatings on leads and other external and internal surfaces of capacitors, resistors, and other passive components. This paper discusses the issues of tin whisker growth with respect to passive components. It also presents both a critical analysis of existing...
متن کاملTin Whiskers Remain A Concern
The elimination of lead in electronic equipment due to governmental regulations (European Union End of Life Vehicle Directive and European Union Restriction of Hazardous Substances Directive) has increased the risk of electrical shorting due to the formation of tin whiskers in electronic products. Tin whiskers are hair-like tin structures that grow sporadically on surfaces coated with tin. Whis...
متن کاملConventional Tin-Lead and RoHS-Compliant Lead-Free Components
1 While lead-frame and wire-bond packages can be provided as eutectic or lead-free, currently Altera flip-chip packages are RoHS compliant. We use Exemption #15 for the first Level Connections between the flip-chip die to the substrate (RoHS Exemption #15: Lead in solders to complete a viable electrical connection between the semiconductor die and the carrier within the integrated circuit flip-...
متن کاملTensile Behavior of Single-Crystal Tin Whiskers
The growth of metallic (predominantly Sn) whiskers from pure metallic platings has been studied for over 50 years. While the phenomenon of Sn whiskering has been studied for decades, very little is known about the mechanical properties of these materials. This can be attributed to the difficulty in handling, gripping, and testing such fine-diameter and high-aspect-ratio whiskers. We report on t...
متن کاملLead-free and Tin-lead Rework Development Activities within the Nemi Lead-free Assembly and Rework Project
With the upcoming European ROHS legislation and other global movements to lead-free assembly, the NEMI lead-free rework group investigated and developed lead-free rework processes for medium to high-end computer products. The work concentrated on development of lead-free hot air convection rework for PBGA, CBGA, and uBGA, and lead-free hand soldering rework for TSOP and 2512 chip components on ...
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ژورنال
عنوان ژورنال: Microscopy and Microanalysis
سال: 2005
ISSN: 1431-9276,1435-8115
DOI: 10.1017/s1431927605503969