Thickness Measuring Process of Nickel Plating on Copper or its Alloy using EDTA

Electroless Nickel Plating on Magnesium Alloy

he inherent lightness and good strength-to-weight ratio of T magnesium has focused attention on increasing applications in aerospace and allied fields. Its density is two thirds that of aluminum-a conventional structure material for aerospace. Magnesium has one drawback: It is prone to atmospheric corrosion. Further, because of its high chemical affinity for aqueous solutions, it is categorized...

Process analysis of electroless copper plating for AB5- type hydrogen storage alloy using support vector regression

Surface modification is an effective method to improve the electrochemical property of hydrogen storage alloy. In order to investigate the influence of process factors of electroless copper (Cu) plating for AB5-type hydrogen storage alloy on Cu coating mass, a novel modeling approach, support vector regression (SVR) combined with particle swarm optimization (PSO), was proposed to construct a ma...

Lower Protrusion of a Copper-Nickel Alloy in a Through-Silicon via and Its Numerical Simulation

The application of Cu-filled through-silicon via (TSV) in 3-D integrated circuit packaging faces several fabrication and reliability issues. In this study, we introduced a Cu-Ni alloy for TSV filling with a high filling speed and a reduced TSV protrusion. In particular, the characteristics of Cu-Ni via protrusions at various annealing temperatures (3200­450°C) were investigated with experimenta...

Electroless Nickel Plating: Pcb Process Modelling and Estimation

Bath and Deposit Monitoring System for Electroless Nickel Plating Process

Electroless nickel plating is a widely used plating method in many industries. The usability of the coating is, however, restricted by the control problems related to the electroless nickel plating process. To ensure deposit quality, the transcendent properties of electroless nickel deposit should be accurately controlled during plating, which is challenging because of the spontaneous, unstable...