Thermo-hydraulic performance of a circular microchannel heat sink using swirl flow and nanofluid

Increasing the power and reliability of microelectronic components requires heat sinks with greater transport performance. This study investigates hydraulic performance a silicon sink under constant flux 100 W/cm2 liquid coolant running through parallel microchannels. The coupled transfer walls coolant, modelled as single-phase fluid, is examined over Reynolds number range 100?Re?350 for micro-channels circular cross-section, straight tape, twisted tape that induces swirl in flow. Al2O3 nanofluid at nanoparticle volume fractions ? = 0, 1, 2 3% used coolant. microchannel flow highest fraction concentration provides lowest thermal resistance contact temperature. Whilst it has higher than micro-channel no cooled by pure water, positive trade-off between gains cooling resistance. makes these configurations attractive designing more performing temperature limited or sensitive micro-electronics.