Thermal Management of Electronics to Avoid Fire Using Different Air Flow Strategies

Due to high heat generation within closely packed smart electronic devices, some efficient thermal management systems are required for their reliable performance, avoid overheating, long lifecycle and safety. In this study, a novel system based on forced air cooling having three airflow configurations is developed explore the characteristics of each configuration. A customized cavity designed have provision (axial, cross, reverse flow) temperature profiles investigated The experiments performed at rates, i.e., 10 W, 20 30 W analyze effectiveness variable rate. It was observed that maximum setup increases with increase in axial flow configuration, has been reduced remarkably by 69 82.4% respectively. Second flow, cross configuration performs better than an overall 65.7~78.6% drop obtained compared enclosed from Furthermore, similar rate trend increased cavity.