Study on low melting nanocrystalline Sn-0.7Cu solder alloy
نویسندگان
چکیده
منابع مشابه
Mechanical Properties and Solder Joint Reliability of Low-Melting Sn-Bi-Cu Lead Free Solder Alloy
The influence of alloy composition of lowmelting Sn-Bi-Cu lead-free solder alloys on mechanical properties and solder joint reliabilities were investigated. The mechanically optimum alloy composition is Sn-40Bi-0.1Cu (mass%). The addition of 40mass%Bi improves the ductility and restrains the fillet-lifting, which are problems of lead-free solders with Bi. The addition of copper improves both th...
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Low-cycle, lap-shear fatigue behavior of Sn-based, Pb-free solder alloys, Sn3.5Ag, Sn-3.5Ag-Cu, Sn-3.5Ag-Bi, and Sn-0.7Cu, were studied at room temperature using specimens with printed circuit board (PCB)/solder/PCB structure under total displacement of ±10 μm, 12 μm, 15 μm, and 20 μm. The fatigue lives of various solder joint materials, defined as 50% load drop, were correlated with the fractu...
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ژورنال
عنوان ژورنال: International Journal of Engineering, Science and Technology
سال: 2018
ISSN: 2141-2839,2141-2820
DOI: 10.4314/ijest.v10i3.2