Structure and properties of Sn-Cu lead-free solders in electronics packaging
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چکیده
منابع مشابه
INTERACTIONS OF Cu-SUBSTRATES WITH TITANIUM-ALLOYED Sn-Zn SOLDERS
The interactions of copper substrate with titanium-alloyed Sn-Zn eutectic solders have been studied. Two series of experiments have been performed. The first one consisted in differential thermal analyses of Sn-Zn nearly eutectic alloys containing from 1.3 to 2.2 wt. % Ti. Diffusion couples consisted of Cu-wires and Sn-Zn-Ti liquid solders, produced at 250 and 275 OC have been prepared in the s...
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The influence of alloy composition of lowmelting Sn-Bi-Cu lead-free solder alloys on mechanical properties and solder joint reliabilities were investigated. The mechanically optimum alloy composition is Sn-40Bi-0.1Cu (mass%). The addition of 40mass%Bi improves the ductility and restrains the fillet-lifting, which are problems of lead-free solders with Bi. The addition of copper improves both th...
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The influence of Cu and Ni additions on the morphology of the intermetallic compounds (IMC) formed at the interface of the liquid Sn-Cu solder and the Cu substrate has been studied. At low Cu concentrations only a thin IMC layer is formed which remains almost unchanged in time and the substrate is dissolving quickly. Ni additions significantly accelerate the growth kinetics of the IMC layer, pr...
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Solder joints are the main weak points of power modules used in harsh environments. For the power module of electric vehicles, the maximum operating temperature of a chip can reach 175 ◦C under driving conditions. Therefore, it is necessary to study the high-temperature reliability of solder joints. This study investigated the creep properties of Sn-3.0Ag-0.5Cu (SAC305) and Sn-8.0Sb-3.0Ag (SSA8...
متن کاملStudy of the Interface Microstructure of Sn-Ag-Cu Lead-Free Solders and the Effect of Solder Volume on Intermetallic Layer Formation
Although the primary driver for the current interest in developing lead-free soldering is global market pressure for more environmentally friendly products, the main concern continues to be lead contamination from end-of-life electronic products in landfill sites. In response to existing and impending legislation in Europe and Japan for the elimination of lead from electronic products, the indu...
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ژورنال
عنوان ژورنال: Science and Technology of Advanced Materials
سال: 2019
ISSN: 1468-6996,1878-5514
DOI: 10.1080/14686996.2019.1591168