Stochastic modeling of functionally graded double lap adhesive joints

Perturbation(s) in the adhesive’s properties originating from manufacturing, glue-line application method and in-service conditions, may lead to poor performance of bonded systems. Herein, effect such uncertainties on adhesive stresses is analyzed via a probabilistic mechanics framework built continuum-based theoretical model. Firstly, generic 2D plane stress/strain linear-elastic model for composite double-lap joint with functionally graded proposed. The developed validated against results obtained an analogous finite element cases joints metal/composite adherends subjected mechanical thermal loadings. Subsequently, proposed analytical reformulated where elastic modulus treated as spatially varying stochastic field homogeneous adhesives. former case represents nature conventional bondline while later showcases perturbation joints. To propagate uncertainty shear peel stresses, we use non-intrusive polynomial chaos approach. For standard deviation modulus, utilized evaluate spatial distribution adhesive, together probability cumulative functions their peaks. A systematic parametric study further carried out mean value Young’s moduli, overlap lengths thicknesses coefficient variation/standard peak due presence random moduli field. It was observed that stiffer adhesives longer bondlengths show smaller variation stresses. findings this underscore predictive capability would be useful design adhesively