Solder Composite Copper Cored Micro-ball for Inner-bump.
نویسندگان
چکیده
منابع مشابه
Improved reliability of copper-cored solder joints under a harsh thermal cycling condition
This study simulated the performance of Cu-cored solder joints in microelectronic components subjected to the extreme thermal cycling conditions often encountered in the automobile industry by comparing the thermal cycling behavior of Cu-cored solder joints containing two different coating layers of Sn– 3.0Ag and Sn–1.0In with that of a baseline Sn–3.0Ag–0.5Cu solder joint under a severe temper...
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The trend to reduce the size of electronic packages and develop increasingly sophisticated electronic devices with more, higher density inputs/outputs (I/Os), leads to the use of area array packages using chip scale packaging (CSP), flip chip (FC), and wafer level packaging (WLP) technologies. Greater attention has been paid to the reliability of solder joints and the assembly yield of the surf...
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ژورنال
عنوان ژورنال: Journal of the Japan Society of Powder and Powder Metallurgy
سال: 2002
ISSN: 0532-8799,1880-9014
DOI: 10.2497/jjspm.49.237