Sn-Ag Solder Bump Process Using 2-Step Plating Method.
نویسندگان
چکیده
منابع مشابه
Effect of under-bump-metallization structure on electromigration of Sn-Ag solder joints
The effect of under-bump-metallization (UBM) on electromigration was investigated at temperatures ranging from 135C to 165C. The UBM structures were examined: 5-μm-Cu/3-μm-Ni and 5 μm Cu. Experimental results show that the solder joint with the Cu/Ni UBM has a longer electromigration lifetime than the solder joint with the Cu UBM. Three important parameters were analyzed to explain the differen...
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 2002
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.5.180