Simulation of Process-Stress Induced Warpage of Silicon Wafers Using ANSYS® Finite Element Analysis
نویسندگان
چکیده
منابع مشابه
Simulation of Process-Stress Induced Warpage of Silicon Wafers Using ANSYS Finite Element Analysis
Wafers warp. It is important to minimize warpage in order to achieve optimal die yield and potentially prevent future device failure. Although the word warpage is widely used in the literature to represent wafer bow (convex or concave shape), in the real world wafers are often seen into warp into saddle shapes. This complicates the characterization of both the sources of and solutions to warpag...
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Reshaping process is a widely used method for producing tubes with non-circular cross sections. Owing to the friction between pipe and rolls, initial round pipe moves forward and consequently, it gradually formed into square or rectangular one. In practice, geometric profile of the rolls will be changed after a while. These changes would be detrimental the production of faultless products. Ther...
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ژورنال
عنوان ژورنال: International Symposium on Microelectronics
سال: 2010
ISSN: 2380-4505
DOI: 10.4071/isom-2010-wa1-paper3