Simulation of Process-Stress Induced Warpage of Silicon Wafers Using ANSYS® Finite Element Analysis

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Simulation of Process-Stress Induced Warpage of Silicon Wafers Using ANSYS Finite Element Analysis

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ژورنال

عنوان ژورنال: International Symposium on Microelectronics

سال: 2010

ISSN: 2380-4505

DOI: 10.4071/isom-2010-wa1-paper3