Simulation and Performance Evaluation of Charge Plasma Based Dual Pocket Biosensor using SiGe-Heterojunction TFET Design

نویسندگان

چکیده

Conventional biosensor designs are often vulnerable to issues like random dopant fluctuations (RDFs) and high thermal budgets due their design the device they based on. The main reason behind such is complexity of maintaining uniform doping levels throughout structure. This manuscript investigates a structure utilizing dual pocket junctionless SiGe-Heterostructured TFET overcome shortcomings. implementation charge plasma technique with $$\mathrm {1}\times \mathrm {10}^{\mathrm {15}} {cm}^{\mathrm {-3}}$$ along an integrated SiGe-Heterostructure layer has improved tunneling process while also effectively eliminating (RDF). Again overall performance depends on sensitivity sensor design. Increasing trapping area for biomolecules at same technological node by increasing length or adding region leads rapid changes in sensor’s electric properties owing shifting dielectric constants (k) densities (in both positive negative situations), improving detection process. influence these parameters device’s Drain current, Surface Potential, Electron Tunneling Rate (ETR), Subthreshold Swing (SS), Ion/Ioff ratio explored. introduction added gives us scalability showing higher {5.38} \times {9}}$$ constant being 12 neutrally charged rising nearly {1.43} {10}}$$ if molecules positively charged. With improvement drain current additional design, this work will undoubtedly give researchers roadmap future generation highly sensitive alternatives.

برای دانلود باید عضویت طلایی داشته باشید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

In GaAs/GaAsSb Heterojunction TFET

Tunnel FETs are a promising alternate to MOSFETs for low power design due to the ability to scale threshold voltage and hence supply voltage, without increase in OFF currents. However, they suffer from low ON currents. Demonstrated here is theenhancement in ION in arsenide–antimonide staggered-gap heterojunction (hetj) tunnel field-effect transistors (TFETs) by engineering the effective tunneli...

متن کامل

Design of High Performance Si/SiGe Heterojunction Tunneling FETs with a T-Shaped Gate

In this paper, a new Si/SiGe heterojunction tunneling field-effect transistor with a T-shaped gate (HTG-TFET) is proposed and investigated by Silvaco-Atlas simulation. The two source regions of the HTG-TFET are placed on both sides of the gate to increase the tunneling area. The T-shaped gate is designed to overlap with N+ pockets in both the lateral and vertical directions, which increases the...

متن کامل

hazard evaluation of gas condensate stabilization and dehydration unit of parsian gas refinery using hazop procedures

شناسایی مخاطرات در واحد 400 پالایشگاه گاز پارسیان. در این پروزه با بکارگیری از تکنیک hazop به شناسا یی مخاطرات ، انحرافات ممکن و در صورت لزوم ارایه راهکارهای مناسب جهت افزایش ایمنی فرا یند پرداخته میگردد. شرایط عملیاتی مخاطره آمیز نظیر فشار و دمای بالا و وجود ترکیبات مختلف سمی و قابل انفجار در واحدهای پالایش گاز، ضرورت توجه به موارد ایمنی در این چنین واحدهایی را مشخص می سازد. مطالعه hazop یک ر...

simulation and design of electronic processing circuit for restaurants e-procurement system

the poor orientation of the restaurants toward the information technology has yet many unsolved issues in regards to the customers. one of these problems which lead the appeal list of later, and have a negative impact on the prestige of the restaurant is the case when the later does not respond on time to the customers’ needs, and which causes their dissatisfaction. this issue is really sensiti...

15 صفحه اول

COMPARISON OF ELECTRO-THERMAL PERFORMANCE OF HETEROJUNCTION BIPOLAR TRANSISTORS BASED ON Si/SiGe AND AlGaAs/GaAs

The aim of this paper is to present a comparison of electro-thermal performance of two HBTs based on Si/SiGe and on AlGaAs/GaAs, by means of an analytical electro-thermal model, already proposed by us, able to calculate the temperature and current distribution for any integrated device, whose structure can be represented as an arbitrary number of superimposed layers with a 2-D embedded thermal ...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

ژورنال

عنوان ژورنال: Silicon

سال: 2022

ISSN: ['1876-9918', '1876-990X']

DOI: https://doi.org/10.1007/s12633-022-02154-z