Shaping Soft Robotic Microactuators by Wire Electrical Discharge Grinding
نویسندگان
چکیده
منابع مشابه
Micro Wire Electrical Discharge Machining , Main Aspects , Tools And
The increasing demand of micro or miniature parts and the development of the micro machining processes are the cause of the growing of micro wire electrical discharge machining (μ-WEDM). μ-WEDM has the ability to manufacture complicate shapes with high accuracy and provides the advantage of machining any conductive materials regardless of their mechanical properties in the absence of significan...
متن کاملA Wear Investigation of Repeatedly Used Wire in Wire Cut Electrical Discharge Machine
Wire electro-discharge machining (WEDM) is a fully extended and competitive machining process widely used for hard and difficult to machine materials. In the present research, experimental investigation have been conducted to find out the wire wear rate at different machining parameter Such as peak current, pulse on time, pulse off time, based on full factorial design of experiment. Molybdenum ...
متن کاملOptimization of machining parameters and wire vibration in wire electrical discharge machining process
Background: Wire Electrical discharge machining (WEDM) has higher capability for cutting complex shapes with high precision for very hard materials without using high cost of cutting tools. During the WEDM process, the wire behaves like a metal string, straightened by two axial pulling forces and deformed laterally by a sum of forces from the discharge process. Major forces acting on the wire c...
متن کاملOptimization of Process Parameter of Wire Electrical Discharge Machine by Response Surface Methodology on Inconel-600
in the present paper, the study has been made to optimize the process parameters during machining of Inconnel-600 by wire electrical discharge machining (WEDM) using response surface methodology (RSM). Four input process parameters of WEDM (namely Peak Current (IP), Pulse-On time (TON), Pulse-Off time (TOFF) and Wire Feed rate (WF)) were chosen as variables to study the process performance in t...
متن کاملSoft-pad grinding of 300 mm wire-sawn silicon wafers: finite element analysis with designed experiments
Silicon wafers are the primary semiconductor substrates used to fabricate Integrated Circuits (ICs). Recently, the industry is making a transition from 200 to 300 mm wafers. To attain very flat 300 mm silicon wafers, grinding has been used to flatten the wire-sawn wafers. However, it is challenging for grinding to remove the waviness induced in wire sawing. To enhance the waviness removal abili...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Micromachines
سال: 2020
ISSN: 2072-666X
DOI: 10.3390/mi11070661