منابع مشابه
Wafer-to-Wafer Bonding for Microstructure Formation
Wafer-to-wafer bonding processes for microstructure fabrication are categorized and described. These processes have an impact in packaging and structure design. Processes are categorized into direct bonds, anodic bonds, and bonds with intermediate layers. Representative devices using wafer-to-wafer bonding are presented. Processes and methods for characterization of a range of bonding methods a...
متن کاملWafer Cut and Rotation for Compound Yield Improvement in 3D Wafer-on-Wafer Stacking
Three-dimensional IC (3D IC) exhibits various advantages over traditional two-dimensional IC (2D IC), including heterogeneous integration, reduced delay and power dissipation, smaller chip area, etc. Wafer-on-wafer stacking is most attractive for 3D IC fabrication, but it suffers from low compound yield. To improve the compound yield, two efforts have been done in this work. First, a hybrid waf...
متن کاملOn the Complexity of Wafer-to-Wafer Integration
In this paper we consider the Wafer-to-Wafer Integration problem. A wafer is a p-dimensional binary vector. The input of this problem is described by m disjoints sets (called "lots"), where each set contains n wafers. The output of the problem is a set of n disjoint stacks, where a stack is a set ofm wafers (one wafer from each lot). To each stack we associate a p-dimensional binary vector corr...
متن کاملApproximation Algorithms for the Wafer to Wafer Integration Problem
Motivated by the yield optimization problem in semiconductor manufacturing, we model the wafer to wafer integration problem as a special multi-dimensional assignment problem (called WWI-m), and study it from an approximation point of view. We give approximation algorithms achieving an approximation factor of 3 2 and 4 3 for WWI-3, and we show that extensions of these algorithms to the case of a...
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ژورنال
عنوان ژورنال: Journal of Micro/Nanolithography, MEMS, and MOEMS
سال: 2013
ISSN: 1932-5150
DOI: 10.1117/1.jmm.12.2.023007