Robust Ag nanoplate ink for flexible electronics packaging
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چکیده
منابع مشابه
Robust Ag nanoplate ink for flexible electronics packaging.
Nanoinks are currently a topic of heightened interest with respect to low temperature bonding processes and printable electronics. We have developed an innovative polyvinylpyrrolidone (PVP)-stabilized Ag nanoplate ink amenable to very strong low temperature packaging, and investigated the relationship between bonding strength and electrical conductivity post-bonding. PVP shell plastic deformati...
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Paper-based writing electronics has received a lot of interest recently due to its potential applications in flexible electronics. To obtain ultra-low resistivity paper-based writing electronics, we developed a kind of ink with high concentration of Ag Nano-particles (up to 80 wt%), as well as a related dispensing writing system consisting an air compressor machine and a dispenser. Additionally...
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Environmentally Responsible Electronics Packaging
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Materials and processes are being developed for packaging of low and medium power, high temperature electronics (up to 500). Ceramic (Al2O3 and AlN) hermetic packages are being used. Die attach techniques based on patterned Au bumps, Au-Si and off-eutectic Au-Sn have been demonstrated. Au thermosonic wire bonding provides a monometallic interconnect system between the die and the package pads. ...
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ژورنال
عنوان ژورنال: Nanoscale
سال: 2015
ISSN: 2040-3364,2040-3372
DOI: 10.1039/c5nr00312a