Research on the molecular scale material removal mechanism in chemical mechanical polishing
نویسندگان
چکیده
منابع مشابه
Material Removal Mechanism in Chemical Mechanical Polishing: Theory and Modeling
The abrasion mechanism in solid-solid contact mode of the chemical mechanical polishing (CMP) process is investigated in detail. Based on assumptions of plastic contact over wafer-abrasive and pad-abrasive interfaces, the normal distribution of abrasive size and an assumed periodic roughness of pad surface, a novel model is developed for material removal in CMP. The basic model is = removed, wh...
متن کاملWafer Scale Variation of Planarization Length in Chemical Mechanical Polishing
Chemical mechanical polishing (CMP) is widely used for pla-narization of advanced interconnect and shallow trench isolation structures in integrated circuit manufacture. Of particular concern is within-die variation in the interlevel dielectric or oxide thickness remaining after polish, due to pattern density variations across the die. 1 Recent modeling of CMP has shown that a " planarization l...
متن کاملA model for chemical–mechanical polishing of a material surface based on contact mechanics
A new contact-mechanics-based model for chemical–mechanical polishing is presented. According to this model, the local polish rate is controlled by the pressure distribution between features on the wafer and the polishing pad. The model uses an analysis based on the work by Greenwood to evaluate this pressure distribution taking into account pad compliance and roughness. Using the model, the e2...
متن کاملMaterial removal in the optical polishing of hydrophilic polymer materials
The optical polishing of hydrophilic polymer materials is a complex process that requires a comprehensive setting of various operating parameters. Based on a series of experimental investigations and dimensional analysis, this paper presents a simple empirical equation to evaluate material removal in the polishing of optical spherical surfaces of hydrophilic polymer materials. It is shown that ...
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ژورنال
عنوان ژورنال: Science Bulletin
سال: 2008
ISSN: 2095-9273,2095-9281
DOI: 10.1007/s11434-008-0268-7