Research on Chemo-Mechanical-Grinding (CMG) of Si wafer
نویسندگان
چکیده
منابع مشابه
Investigations of silicon wafer grinding using finite element analysis
Silicon wafers are used as substrates to build more than 90% of integrated circuits. One of the manufacturing processes for silicon wafers is grinding. This paper reports the investigations of silicon wafer grinding using Finite Element Analysis (FEA). FEA models are first used to study the effects of process parameters on waviness reduction in the grinding of wire-sawn wafers on a rigid chuck....
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Synchrotron Radiation from the Stanford Synchrotron Radiation Laboratory (SSRL) has been used as an excitation source for Total Reflection X-ray Fluorescence Analysis (TXRF) of Na impurities on Si wafer surfaces. A wafer intentionally contaminated by a droplet containing 1.4 x 10 atoms/cm of sodium and a wafer uniformly contaminated with 4.4 x 10 atoms/cm of Na were investigated. The minimum de...
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It is reported that the silicon nanocrystals (NCs) are fabricated by using self-assembly growth method with the annealing and the electron beam irradiation processes in the pulsed laser depositing, on which the visible lasing with higher gain (over 130 cm-1) and the enhanced emission in optical telecommunication window are measured in photoluminescence (PL). It is interesting that the enhanced ...
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The electric thickness of the semi-finished radome may not meet the requirement for the electromagnetic performance because it varies with both the geometry thickness and the electric inductivity of the radome. One way to obtain the required value of the electric thickness is to compensate the electric thickness error by modifying the wall thickness of the radome. To this end, a grinding machin...
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ژورنال
عنوان ژورنال: Journal of the Japan Society for Precision Engineering
سال: 2015
ISSN: 0912-0289,1882-675X
DOI: 10.2493/jjspe.81.957