Reliable low-temperature die attach process using Ag/Sn/Ag sandwich structure for high-temperature semiconductor devices
نویسندگان
چکیده
منابع مشابه
Die Attach for High Temperature Electronics Packaging
AuSi, patterned Au and off-eutectic Sn-Au-Sn die attach materials and processes have been investigated for SiC die attach for high temperature applications. AuSi shear test results after 3000 hours of aging at 325C in air showed only a slight decrease in shear strength when assembled on Mo:Mn/Pd/Au metallized AlN. However, when assembled on Mo:Mn/Ni/Au metallized AlN, the die shear strength dec...
متن کاملTest vehicle for studying thermal conductivity of die attach adhesives for high temperature electronics
Polymer adhesives offer a viable method for mounting silicon dies for high temperature applications. Here a test vehicle for comparing the thermal conductivity of different die attach materials is presented. The setup can be used to determine the degree of degradation of polymers. It consists of a mock die that has an integrated thick film heater, which is mounted onto a substrate. In operation...
متن کاملPb-Free High Temperature Solder Joints for Power Semiconductor Devices
Three types of inexpensive Pb-free solder joints, namely Zn-based and Bi-based solders, and a CuSn alloy were studied for application to the high-temperature operation of wide band-gap power semiconductor devices using GaN or SiC. Zn– Al solder sheets, whose melting point is 380°C were prepared, and then surface oxides were removed by RF plasma etching. Subsequently, Cu thin films were deposite...
متن کاملDevelopment of Silicon Carbide Semiconductor Devices for High Temperature Applications
The semiconducting properties of electronic grade silicon carbide (SiC) crystals, such as its wide energy bandgap, make it particularly attractive for high temperature applications. Applications for high temperature electronic devices include instrumentation for engines under development, engine control and condition monitoring systems, and power conditioning and control systems for space platf...
متن کاملStudy of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy
Silver sintering joints and AuGe soldering are promising technologies for high temperature (>200 C ambient) power electronics packaging. This paper presents the implementation of two silver-sintering processes with the one hand micrometer-scale silver particles, and on the other hand nano-meter-scale particles. Two substrates technologies have been investigated: A12O3 DBC and Si3N4 AMB. After t...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Scientific Reports
سال: 2019
ISSN: 2045-2322
DOI: 10.1038/s41598-018-37103-7