Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging
نویسندگان
چکیده
منابع مشابه
Reliability challenges in 3D IC packaging technology
0026-2714/$ see front matter 2010 Elsevier Ltd. A doi:10.1016/j.microrel.2010.09.031 E-mail address: [email protected] At the moment, a major paradigm change, from 2D IC to 3D IC, is occurring in microelectronic industry. Joule heating is serious in 3D IC, and vertical interconnect is the critical element to be developed. Also reliability concerns will be extremely important. For example, in order ...
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ژورنال
عنوان ژورنال: Micromachines
سال: 2021
ISSN: 2072-666X
DOI: 10.3390/mi12030295