Reduction of Plasma Process Induced Damage during HDP IMD Deposition

Pathogen Reduction of Plasma

Role of film conformality in charging damage during plasma-assisted interlevel dielectric deposition

While observations of charging damage during plasma-assisted deposition have been erratic thus far, concern abounds that it may worsen as aspect ratios increase and high-density plasmas are used more frequently. Simulations of pattern-dependent charging during interlevel dielectric deposition reveal that the initial conformality of the dielectric film plays a crucial role in metal line charge u...

Plasma Charging Damage Induced by a Power Ramp Down Step in the end of Plasma Enhanced Chemical Vapour Deposition (PECVD) Process

Plasma Enhanced Chemical Vapour Deposition (PECVD) is one of the main plasma processes which induce charging damage to gate oxides during the VLSI processes. All the previous studies, however, describe the charging phenomena only at the beginning of PECVD process, when a very thin oxide layer covers the metal lines. We present and analyze in this paper, a new strong charging phenomenon in the e...

Morphological Transition in Diamond Thin-Films Induced by Boron in a Microwave Plasma Deposition Process

The purpose of this study is to understand the basic mechanisms responsible for the synthesis of nanostructured diamond films in a microwave plasma chemical vapor deposition (MPCVD) process and to identify plasma chemistry suitable for controlling the morphology and electrical properties of deposited films. The nanostructured diamond films were synthesized by MPCVD on Ti-6Al-4V alloy substrates...

Particle Reduction at Metal Deposition Process in Wafer Fabrication

Metal Deposition or metallization process is one of the processes in fabricating a wafer. A wafer is a thin slice of semiconductor material, such as a silicon crystal, used in the fabrication of integrated circuits and other micro-devices. Due to the nature on the process, it creates lot of particles, which would impact the next process if it were not removed. Particle deposition on the wafer s...