Power-Substrate Static Thermal Characterization Based on a Test Chip
نویسندگان
چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: IEEE Transactions on Device and Materials Reliability
سال: 2008
ISSN: 1530-4388
DOI: 10.1109/tdmr.2008.2005299