Polyimide foam composites with nano-boron nitride (BN) and silicon carbide (SiC) for latent heat storage

Silicon Nitride and Silicon Carbide

Boron carbide/n-silicon carbide heterojunction diodes

Hexagonal boron nitride and 6H-SiC heterostructures

Enhanced thermal conductivity of polyimide films via a hybrid of micro- and nano-sized boron nitride.

A new thermally conductive polyimide composite film has been developed. It is based on a dispersion of different particle sizes of boron nitride (BN) in a polyimide (PI) precursor, polyamic acid (PAA). Subsequently, thermal imidization of PAA at 350 degrees C produced the corresponding polyimide composites. 3-Mercaptopropionic acid was used as the surfactant to modify the BN surface for the dis...

Pnma-BN: Another Boron Nitride Polymorph with Interesting Physical Properties

Structural, mechanical, electronic properties, and stability of boron nitride (BN) in Pnma structure were studied using first-principles calculations by Cambridge Serial Total Energy Package (CASTEP) plane-wave code, and the calculations were performed with the local density approximation and generalized gradient approximation in the form of Perdew-Burke-Ernzerhof. This BN, called Pnma-BN, cont...