Planarization CMP Technology and Applicable Materials in Semiconductor Process
نویسندگان
چکیده
منابع مشابه
A Low Cost Semiconductor Metallization/ Planarization Process
This paper presents an electrically-mediated process for copper metallization of semiconductor interconnect features. Compared to traditional metallization processes, the proposed electrochemical deposition process uses a singlecomponent bath that contains no difficult-to-control organic accelerators and levelers. The feasibility of the process is demonstrated by copper deposition onto sectione...
متن کاملCustomer Application Brief Electronics Chemical Mechanical Planarization (CMP) Slurry Manufacturing
Introduction The Chemical Mechanical Planarization (CMP) process plays a key role in the manufacture of data storage, video display panels, and semiconductor chips. The process combines the chemical (acidic or basic) effect of the slurry, which contains micro-abrasives with the mechanical effect provided by polishing to reduce the topography on the wafer or rigid disk substrate. The process for...
متن کاملCopper CMP and Process Control
A production worthy, copper CMP technology has been successfully developed on a multi-platen CMP system. The System consists of three polish platens, each of which is equipped with an optical endpoint detection system. The process consists of three steps with different polish slurries, and is designed to polish copper with a tantalum based barrier, and to achieve good defect performance. Patter...
متن کاملDirect Measurement of Planarization Length for Copper Chemical Mechanical Planarization Polishing (cmp) Processes Using a Large Pattern Test Mask
We have used a large pattern test mask and a specific arrangement of structures on a wafer for direct measurement of an average planarization length for copper chemical mechanical polishing (CMP) processes. We propose new minimum, maximum, and average planarization length definitions, based on up and down area measurements as a function of trench width. The average planarization length is usefu...
متن کاملModeling of Advanced Integrated Circuit Planarization Processes: Electrochemical-Mechanical Planarization (eCMP), STI CMP using Non-Conventional Slurries
Progression of technology nodes in integrated circuit design is only possible if there are sustainable, cost-efficient processes by which these designs can be implemented. As future technologies are increasing device density, shrinking device dimensions, and employing novel structures, semiconductor processing must also advance to effectively and efficiently process these devices. Arguably one ...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Kobunshi
سال: 2006
ISSN: 0454-1138,2185-9825
DOI: 10.1295/kobunshi.55.78