Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization
نویسندگان
چکیده
منابع مشابه
Wafer-level Cu-Cu bonding technology
0026-2714/$ see front matter 2011 Elsevier Ltd. A doi:10.1016/j.microrel.2011.04.016 ⇑ Corresponding author. E-mail address: [email protected] (K.-N. C Semiconductor industry currently utilizes copper wafer bonding as one of key technologies for 3D integration. This review paper describes both science and technology of copper wafer bonding with regard to present applications. The classifi...
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ژورنال
عنوان ژورنال: Journal of Electronic Materials
سال: 2013
ISSN: 0361-5235,1543-186X
DOI: 10.1007/s11664-013-2711-z