Optical smart packaging to reduce transmitted information
نویسندگان
چکیده
منابع مشابه
Wafer-Level Vacuum Packaging of Smart Sensors
The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors-"low cost" for ubiquitous presence, and "smart" for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, we can further greatly reduce the cost of sensor components and systems as well as further decreas...
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ژورنال
عنوان ژورنال: Optics Express
سال: 2011
ISSN: 1094-4087
DOI: 10.1364/oe.20.000158