Novel lithography technology for enhancing resolution limit at advanced packaging manufacturing
نویسندگان
چکیده
Abstract New lithography method will be proposed in the paper to enhance resolution limit by half of current one while keeping depth focus at same value. The is based on and copper plating process order applicable advanced packaging manufacturing.
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ژورنال
عنوان ژورنال: Proceedings of the ... International Symposium on Microelectronics
سال: 2021
ISSN: ['1085-8024']
DOI: https://doi.org/10.4071/1085-8024-2021.1.000045