Novel Abrasive-Impregnated Pads and Diamond Plates for the Grinding and Lapping of Single-Crystal Silicon Carbide Wafers

In this study, special ceramic grinding plates impregnated with diamond grit and other abrasives, as well self-made lapping plates, were used to prepare the surface of single-crystal silicon carbide (SiC) wafers. This novel approach enhanced process reduced final chemical mechanical planarization (CMP) polishing time. Two different pads mixed abrasives prepared: one self-modified + SiC a binder SiO2 Al2O3 binder. The properties removal rate substrate investigated comparison traditional method was conducted. experimental results showed that material (MRR) higher for abrasive plate than method. wear could be by 31.6%. roughness samples polished using diamond-impregnated markedly better copper plate. However, while finish efficiency high, abrasive-impregnated high. clear indication effective lapping.