منابع مشابه
Bonding to the Chip Face
‘Wire bonding’ is used throughout the microelectronics industry for interconnecting dice, substrates and output pins. Fine wires, generally of aluminium or gold 18–50μm in diameter, are attached using pressure and ultrasonic energy to form metallurgical bonds. Devices bonded with gold wire generally need additional thermal energy, and the bonding process is referred to as ‘thermosonic’ rather t...
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Millimeter wave radars have been developed and marketed for the purpose of reduction in deaths in traffic accidents and traffic congestion. However, the millimeter wave radars need to be cheaper to be used more widely. In order to make the radars cheaper, we developed a new MMIC (Monolithic Microwave IC) structure and bonding technology, focusing on reducing costs of RF-modules. This article de...
متن کاملA New Programmable RF System for System-on-Chip Applications
This paper presents a new programmable radio frequency (RF) system for a System-onChip (SoC) transceiver. A 5-GHz low noise amplifier (LNA) is integrated with an on-chip programmable RF circuits using 0.18μm SiGe technology. Proposed system is very useful for concurrent RF ICs in a complete RF system environment. The programmable circuit helps it to provide DC output voltages, hence, making the...
متن کاملBrazing & Soldering Today
Brazed components play an essential role in consistent joining techniques. The brazing process is characterized by low process temperatures and fast processing times, compared to welding techniques. Beside the resulting low manufacturing costs, brazing can join dissimilar materials, e.g. metals and ceramics. Consequently, brazing provides potential for many industrial applications like the prod...
متن کاملBrazing & Soldering Today
JULY 2012 50 High-temperature solder alloys are extensively used in dieattach, power semiconductor, and optical device packaging, flip-chip packaging, etc. Current industry standard solders for these applications are mainly high-lead solders (90–97 wt-% Pb) and gold-based eutectic solder alloys such as the 80Au20Sn solder. The die-attach process involves connecting the silicon die or chips to a...
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ژورنال
عنوان ژورنال: DENKI-SEIKO[ELECTRIC FURNACE STEEL]
سال: 1990
ISSN: 1883-4558,0011-8389
DOI: 10.4262/denkiseiko.61.272